Emerging Advanced Packaging Technologies and Their Impact on Modern Computer Architecture
DOI:
https://doi.org/10.63282/3050-9246.IJETCSIT-V6I1P107Keywords:
Advanced Packaging, Chiplet Architecture, 3D Integration, Fan-Out Wafer-Level Packaging (FOWLP), Modern ComputingAbstract
Modern computer architecture is heavily dependent on advanced packaging technologies. As Moore's Law begins to decline, semiconductor manufacturers will continue performance scaling by means of innovations in packaging. However, technologies to implement 2.5D, 3D integration, Fan-Out Wafer Level Packaging (FOWLP), and chiplet architecture all contain distinct performance, power efficiency, and integra tion density advantages. This paper analytically studies the methodologies of emerging advanced packaging technologies and their impact on modern computing paradigms. This paper presents a comparative study that illustrates how these technologies can reduce the form factor and consume less power while improving computing performance. Key applications, namely data centers, HPC, and Edge Computing, are discussed. We finally discuss the current challenges, what the prospects might be, and what may be the potential breakthroughs to advanced semiconductor packaging
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References
[1] Pavlidis, V. F., Savidis, I., & Friedman, E. G. (2017). Three-dimensional integrated circuit design. Newnes.
[2] Xie, Y., Cong, J., & Sapatnekar, S. (2010). Threedimensional integrated circuit design. EDA, Des. Microarchitectures, 20, 194-196.
[3] Topol, A. W., La Tulipe, D. C., Shi, L., Frank, D. J., Bernstein, K., Steen, S. E., ... & Ieong, M. (2006). Three-dimensional integrated circuits. IBM Journal of Research and Development, 50(4.5), 491-506.
[4] Lu, D., & Wong, C. P. (Eds.). (2009). Materials for advanced packaging (Vol. 181). Boston, MA, USA: Springer US.
[5] Hennessy, J. L., & Jouppi, N. P. (1991). Computer technology and architecture: An evolving interaction. Computer, 24(9), 18-29.
[6] Chen, Z., Zhang, J., Wang, S., & Wong, C. P. (2023). Challenges and prospects for advanced packaging. Fundamental Research.
[7] Cao, L., & Krusius, J. (1995). Concurrent packaging architecture design. IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 18(1), 66-73.
[8] Yuan, Y. (2024, July). 3D packaging and Moore’s Law. In Journal of Physics: Conference Series (Vol. 2798, No. 1, p. 012048). IOP Publishing.
[9] Next-Gen Electronics: Exploring the Impact of Advanced Semiconductor Packaging, electronics era, online. https://electronicsera.in/next-gen-electronicsexploring-the-impact-of-advanced-semiconductorpackaging/
[10] Iyer, S. S. (2017, October). Packaging without the Package is More Holistic than Moore's Law. In International Symposium on Microelectronics (Vol. 2017, No. S1, pp. 1-40). International Microelectronics Assembly and Packaging Society.
[11] Khalid, S., Hassan, S. A., Javaid, H., Zahid, M., Naeem, M., Bhat, Z. F., ... & Aadil, R. M. (2024). Factors responsible for spoilage, drawbacks of conventional packaging, and advanced packaging systems for tomatoes. Journal of Agriculture and Food Research, 15, 100962.
[12] Mahalik, N. P. (2014). Advances in packaging methods, processes, and systems. Challenges, 5(2), 374-389.
[13] Wang, H., Ma, J., Yang, Y., Gong, M., & Wang, Q. (2023). A review of system-in-package technologies: application and reliability of advanced packaging. Micromachines, 14(6), 1149.
[14] Advanced Packaging Design Processes for Modern Technology Challenges, Zuken, online. https://www.zuken.com/us/blog/advanced-packagingdesign-processes-for-modern-technology-challenges/
[15] Mallik, D., Radhakrishnan, K., He, J., Chiu, C. P., Kamgaing, T., Searls, D., & Jackson, J. D. (2005). Advanced Package Technologies for High-Performance Systems. Intel Technology Journal, 9(4).
[16] Witek-Krowiak, A., Szopa, D., & Anwajler, B. (2024). Advanced Packaging Techniques—A Mini-Review of 3D Printing Potential. Materials, 17(12), 2997. [17] Beica, R., Ivankovic, A., Buisson, T., Kumar, S., & Azemar, J. (2015, October). The growth of advanced packaging: An overview of the latest technology developments, applications, and market trends. In International Symposium on Microelectronics (Vol. 2015, No. 1, pp. 000001-000005). International Microelectronics Assembly and Packaging Society.
[18] Understanding Advanced Packaging Technologies and Their Impact on the Next Generation of Electronics, Semiconductor Engineering, online. https://semiengineering.com/understanding-advancedpackaging-technologies-and-their-impact-on-the-nextgeneration-of-electronics/
[19] Udkar S. Harnessing Photonic Computing for NextGeneration CPUs and GPUs in High-Performance Computing. 2022, 5(4):23-36.
[20] Cabrera-Rios, M., Mount-Campbell, C. A., & Irani, S. A. (2002). An approach to the design of a manufacturing cell under economic considerations. International Journal of Production Economics, 78(3), 223-237.
