Heat Dissipation Strategies for High-Performance Computing: A Review of Air and Liquid Cooling Efficiency
DOI:
https://doi.org/10.63282/3050-9246.IJETCSIT-V3I1P116Keywords:
High-Performance Computing, Heat Dissipation, Air Cooling, Liquid Cooling, Energy Efficiency, Thermal ManagementAbstract
Heat dissipation and energy efficiency management have become more important concerns due to the growing computational demands of HPC systems. The drawbacks of conventional air-cooling systems that rely on heat sinks, fans, and ducts include poor heat conductivity, uneven airflow, and rising power demands as heat densities increase. As a result of this, liquid cooling technologies, including direct to chip, immersion, and microchannel cold plate, have become the better choice with better heat transfer coefficient, temperature uniformity, and Power Usage Effectiveness (PUE). Literature shows that liquid cooling may reduce the temperature of the components in a system by a significant margin; reduce the thermal resistance in the system and increase the long-term reliability of the system and provide the benefit of saving energy and making the system sustainable by reusing heat. With comparative analysis, it is noted that liquid cooling is up to 30-50% more efficient and stable to extreme workloads compared to the air-based approaches. Measures such as PUE, CUE and WUE further measure the enhanced energy, carbon and water efficiency. The given review summarizes the progress that has been made in both air and liquid cooling methods, focusing on the shift towards high-density cooling systems that are environmentally friendly. It also highlights the significance of optimized thermal designs in guaranteeing performance as well as reliability, and cost effectiveness of next generation infrastructures of HPC and data centres.
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